A recent leak on Weibo suggests that apart from the Snapdragon 845, Qualcomm is preparing at least three more chips for 2018 devices. Likely aimed at the mid-range segment, these are the Snapdragon 670, 640 and 460.
Photo: GSMArena
The Snapdragon 670 is an octa-core processor that uses 4 Kryo 360 cores at 2GHz, and 4 slower Kryo 385 cores at 1.6GHz. It uses an Adreno 620 GPU and is built on a 10nm process, which should translate to improved power efficiency. It can also support up to a 26MP single camera unit, or dual 13MP units.
The Snapdragon 640 on the other hand, utilizes 8 Kryo 360 cores, 2 at 2.15GHz, and 6 at 1.55GHz. It uses an Adreno 610 GPU, but is equipped with the same ISP as the SD670.
Finally, there’s the Snapdragon 460, a chip built on a 14nm process and is probably intended for budget smartphones. It utilizes the same X12 LTE modem as the 640, has 8 Kryo 360 cores – 4 at 1.8GHz, and 4 at 1.4GHz, and is fitted with the Spectra 240 ISP which supports up to a 21MP single camera unit.
Whether this leak is 100% accurate remains to be a question. Regardless, this makes us even more excited for the new devices that we’ll see in 2018.
Source: GSMArena, Photo: Ars Technica
Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.
