Qualcomm Debuts its 2nd Generation 3D Sonic Sensor

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Qualcomm 3D Sonic Sensor Gen 2Qualcomm has announced 3D Sonic Gen 2, the second iteration of its in-display fingerprint solution which uses sound waves to scan for 3D features in a fingerprint.

The company claims that this next-gen solution is 50% faster and 77% larger compared to its predecessor, which had accuracy issues due to the smaller activation area.

Since the new sensor only measures 0.2mm thin at the scan area, this opens the possible use-case of it being in a foldable.

To refresh your memory, the first generation was used in Samsung’s Galaxy S10, Note10, S20, and Note20 series, but was not really up to par with what the competition was using in terms of accuracy and speed.

Qualcomm’s 3D Sonic Sensor Gen 2 is expected to make its way into smartphones in early 2021, which makes sense since Samsung is set to launch its newest flagships tomorrow.

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Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.

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