AMD has just announced the 3rd generation EPYC Processors with AMD 3D V-cache technology which was formerly codenamed “Milan-X”.
These are the new data center CPUs that use 3D die stacking and are built on the “Zen 3” core architecture thus expanding the 3rd Gen EPYC CPU family. Moreover, these CPUs deliver up to 66% more performance compared across different technical computing workloads compared to nonstacked 3rd Gen AMD EPYC processors.
These latest processors sport the largest L3 cache in the industry but still deliver the same socket, software compatibility, and modern security features. They deliver great performance for technical computing such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA), and structural analysis.
“Building upon our momentum in the data center as well as our history of industry-firsts, 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology showcase our leading design and packaging technology enabling us to offer the industry’s first workload-tailored server processor with 3D die stacking technology. Our latest processors with AMD 3D V-Cache technology provide breakthrough performance for mission-critical technical computing workloads leading to better-designed products and faster time to market.”
Dan McNamara, senior vice president, and general manager, Server Business Unit, AMD
“Customers’ increased adoption of data-rich applications requires a new approach to data center infrastructure. Micron and AMD share a vision of delivering the full capability of leading DDR5 memory to high-performance data center platforms. Our deep collaboration with AMD includes readying AMD platforms for Micron’s latest DDR5 solutions as well as bringing 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology into our own data centers, where we are already seeing up to a 40% performance improvement over 3rd Gen AMD EPYC processors without AMD 3D V-Cache on select EDA workloads.”
Raj Hazra, senior vice president and general manager of the Compute and Networking Business Unit at Micron
Leading Packaging Innovations
Cache size increases have been the driving force in increasing performance improvement specifically for technical computing workloads that rely on large data sets. Having said that. 2D chips designs have reached the physical limitations for increasing the cache size on CPUs.
To beat this limitation, AMD’s 3D V-cache technology binds the “AMD Zen 3” core to the cache module that increases the amount of L3 cache while minimizing latency and improving throughput.
Breakthrough Performance
The 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology deliver faster time-to-results on targeted workloads, such as
- EDA – The 16-core, AMD EPYC 7373X CPU can deliver up to 66 percent faster simulations on Synopsys VCS, when compared to the EPYC 73F3 CPU.
- FEA – The 64-core, AMD EPYC 7773X processor can deliver, on average, 44 percent more performance on Altair Radioss simulation applications compared to the competition’s top-of-stack processor.
- CFD – The 32-core AMD EPYC 7573X processor can solve an average of 88 percent more CFD problems per day than a comparable competitive 32-core count processor while running Ansys CFX.
These performance capabilities allow you to deploy fewer servers and reduce power consumption in your data center. This helps to lower your total cost of ownership (TCO), reduce your carbon footprint, and promote environmental sustainability.
In short, if you choose the new 3rd Gen AMD EPYC processors with AMD 3D V-Cache this deployment would result in having the environmental sustainability benefit of more than 81 acres of US forest per year in carbon sequestered equivalents.
3rd Gen AMD EPYC processor with AMD 3D V-Cache Technology Product Chart
| Cores | Model | # CCD | TDP (W) | cTDP range (W) | Base Frequency (GHz) | Max Boost Frequency (GHz)* | L3 Cache (MB) | DDR Channels | Price (1KU) |
|---|---|---|---|---|---|---|---|---|---|
| 64 | 7773X | 8 | 280 | 225-280 | 2.20 | 3.50 | 768 | 8 | USD 8,800 |
| 32 | 7573X | 8 | 280 | 225-280 | 2.80 | 3.60 | 768 | 8 | USD 5,590 |
| 24 | 7473X | 8 | 240 | 225-280 | 2.80 | 3.70 | 768 | 8 | USD 3,900 |
| 16 | 7373X | 8 | 240 | 225-280 | 3.05 | 3.80 | 768 | 8 | USD 4,185 |
Industry-wide Ecosystem Support
3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are available today from a wide array of OEM partners, including, Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT, and Supermicro.
These CPUs are also broadly supported by AMD software ecosystem partners, including, Altair, Ansys, Cadence, Dassault Systèmes, Siemens, and Synopsys.
Microsoft Azure HBv3 virtual machines (VMs) have now been fully upgraded to 3rd Gen AMD EPYC with AMD 3D V-Cache technology. According to Microsoft, HBv3 VMs are the fastest adopted addition to the Azure HPC platform ever and have seen performance gains of up to 80 percent in key HPC workloads from the addition of AMD 3D V-Cache compared to the previous HBv3 series VMs.
Watch the video announcement here and visit the landing page for 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology to learn more.
Started his freelancing adventure in 2018 and began doing freelance Audio Engineering work and then started freelance writing a few years later.
Currently he writes for Gadget Pilipinas and Grit.PH.
He is also a musician, foody, gamer, and PC enthusiast.
