MediaTek: More Dimensity 9000/8100/8000-Powered Devices Coming in Q3

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MediaTek recently concluded a virtual roundtable, wherein it reported its latest achievements and innovations, plus its outlook into what’s next for connectivity.

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The company had a very strong 2021, wherein it achieved a revenue of 17.6B, an overall market share of 42%, and an Android market share of >50.6%.

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They also showcased their flagship and premium chipsets – the Dimensity 9000 and 8100/8000, which power several recently-released devices from various brands including OPPO, vivo, Redmi, realme, and OnePlus, and with 6+ more devices expected for Q2/Q3 for the former, and >10 additional models expected in Q2/Q3 for the latter.

There’s the Filogic networking SoCs – Filogic 380 which offers features like Bluetooth 5.3, and peak data rates of up to 6.5gbps, and the Filogic 880 which features a quad-core CPU and offers Wi-Fi 7 performance.

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MediaTek also introduced its Genio SoCs, primarily designed for all various AIoT applications. Offering high performance and efficiency, long-term support for system updates and security patches, as well as Wi-Fi and 5G connectivity, among a number of other features. Then there’s the T750, the world’s 1st 5G CPE chipset. It’s powered by a 2GHz Quad-Core CPU and designed for use with mobile hotspot CPE devices.

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Locally, MediaTek’s 5G-capable chipsets are also found in at the mid-range and more budget-oriented segments. Perfect cases in point are the Cherry Mobile Aqua SV and Aqua S10 Pro 5G. The MediaTek T750 is also used in the Smart Bro Home WiFi 5G device, allowing households to enjoy the benefits of the technology for various purposes.

For more information, you may visit MediaTek’s official website.

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Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.

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