According to a report from leakster Digital Chat Station, Qualcomm and MediaTek will use TSMC’s foundry to manufacture their next chipsets. The Qualcomm chipsets reportedly switching to the new node are specifically the Snapdragon 8 Gen 2 and Snapdragon 7 Gen 2, while the MediaTek chipsets are said to be the Dimensity 9100 and 8200.
Industry insiders revealed that the development of both new Qualcomm chipsets is faster than their MediaTek counterparts within TSMC.
The Snapdragon 8 Gen 2 and Dimensity 9100 SoCs are said to power many Android flagship devices in 2023. Meanwhile, the Snapdragon 7 Gen 2 and Dimensity 8200 will battle it out in the mid-range market.
Other reports mentioned that the Snapdragon 7 Gen 2 will just be an iterative upgrade over Snapdragon 7 Gen 1 with hardly any changes to its hardware aside from the switch from Samsung’s 4nm to the TSMC 4nm node. Because of this, it is speculated that this could instead be named the Snapdragon 7+ Gen 1 instead of a Gen 2.
Previously, Qualcomm used the Samsung 4nm process for the Snapdragon 8 Gen 1 and the Samsung 5nm process for the Snapdragon 888+ and Snapdragon 888. However, following the overheating issues of the Snapdragon 8 Gen 1, Qualcomm moved to TSMC manufacturing of the Snapdragon 8+ Gen 1.
The Snapdragon 8 Gen 2 is expected to be introduced at the Snapdragon Summit which will be held on November 15-17. So we’ll just have to wait around two months
Ram found his love and appreciation for writing in 2015 having started in the gaming and esports sphere for GG Network. He would then transition to focus more on the world of tech which has also began his journey into learning more about this world. That said though, he still has the mentality of "as long as it works" for his personal gadgets.
