AMD has postponed the launch of its AMD Ryzen 9000 series due to an unspecified quality issue, resulting in the withdrawal of all AMD Ryzen 9000 Series units from retailers and OEMs worldwide.
“We appreciate the excitement around the Ryzen 9000 series processors. During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations. Out of an abundance of caution and to maintain the highest quality experiences for every Ryzen user, we are working with our channel partners to replace the initial production units with fresh units. As a result, there will be a short delay in retail availability. The Ryzen 7 9700X and Ryzen 5 9600X processors will now go on sale on August 8th and the Ryzen 9 9950X and Ryzen 9 9900X processors will go on sale on August 15th. We pride ourselves in providing a high-quality experience for every Ryzen user, and we look forward to our fans having a great experience with the new Ryzen 9000 series.”
Jack Huynh, AMD SVP and GM of Computing and Graphics
AMD Ryzen 9000 Series Unspecified Quality Issues Caused Delays
AMD will launch Ryzen 7 9700X and Ryzen 5 9600X processors on August 8, with higher-end Ryzen 9 9950X and Ryzen 9 9900X delayed until August 15. This is an unprecedented move for AMD, as it discovered an unspecified quality issue with Ryzen 9000 processors during packaging testing.
Moreover, the chip manufacturer is recalling all Ryzen 9000 chips globally to prevent quality issues, ensuring no damaged chip is delivered to customers. The Ryzen AI 300 mobile processors are set for launch at the end of the month. The company will re-screen the chips and return unaffected models to retail channels.
AMD has identified a quality issue with its packaging for Ryzen 9000 series processors, potentially leading to a small number of products not meeting quality standards. The company is working to prevent customers from receiving the first wave of Ryzen 9000 processors, which could be difficult due to its global supply chains.
To help solve the issue, AMD is implementing a robust screening process to ensure the quality of its processors. The process includes checking the die on the wafer before packaging to ensure it is a Known Good Die (KGD), and then the completed processor after packaging. Automated software routines are used to test the processors in various ways, including loading operating systems, to eliminate issues. This ensures that AMD’s products are shipped safely and without defects.
The final testing step in the packaging tests can occur during or after the packaging process, and issues may not directly relate to the packaging implementation. AMD’s Ryzen 9000 series processors use simpler packaging, mounting an I/O Die on a standard substrate and connecting it to compute cores using high-speed SERDES.
AMD’s packaging technique, known for its simplicity, high yields, and cost-effectiveness, has disrupted the market. However, potential issues like material contamination and substrate underside issues could arise. AMD aims to avoid similar mistakes as rival Intel, which has faced criticism for allowing crashing issues.
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