MediaTek today announced the Dimensity 7300 and Dimensity 7300X, a pair of ultra-efficient 4nm chipsets designed for high-performance mobile devices. These new system-on-chips provide best-in-class power efficiency along with excellent performance capabilities for multitasking, photography, gaming, and AI computing.
The Dimensity 7300 series is built around an octa-core CPU with 4 Arm Cortex-A78 cores up to 2.5GHz and 4 Cortex-A55 cores. Manufactured on a 4nm process, the A78 cores offer up to 25% better power efficiency compared to the previous Dimensity 7050. The chips also feature an Arm Mali-G615 GPU and MediaTek’s HyperEngine suite of gaming enhancements for smooth, power-efficient gaming.
“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game. Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”
– Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business
Photography capabilities are enhanced through the Imagiq 950 ISP supporting up to 200MP cameras. It offers faster face detection, noise reduction, live focus and photo remastering compared to prior generations. 4K HDR video recording is also improved.
On the AI side, the new APU 655 doubles AI performance over the 7050 chip. It supports mixed precision computing to reduce memory needs for large AI models.
The Dimensity 7300 series supports ultra-high resolution WQHD+ displays with 10-bit color and HDR video playback. The 7300X adds dedicated hardware for dual-screen foldable devices.
Both chips integrate MediaTek’s latest 5G UltraSave power optimizations, ultra-fast WiFi 6E connectivity, dual 5G SIM capabilities and more.
The Dimensity 7300 series will power a new wave of ultra-efficient yet highly capable 5G smartphones and mobile computing devices in the second half of 2023. For more information, visit MediaTek’s website.
FAQ
Q: What process node are the Dimensity 7300/7300X built on?
A: The chips use TSMC’s 4nm process technology.
Q: What CPU cores do they use?
A: An octa-core CPU with 4 Arm Cortex-A78 performance cores and 4 Cortex-A55 efficiency cores.
Q: What GPU is integrated?
A: The Arm Mali-G615 GPU along with MediaTek’s HyperEngine gaming enhancements.
Q: What camera capabilities do the chips enable?
A: The Imagiq 950 ISP supports up to 200MP main cameras and 4K HDR video capture.
Q: What AI performance improvements are there?
A: The APU 655 doubles AI performance compared to the previous generation.
Q: Do the chips support foldable/dual-screen devices?
A: The Dimensity 7300X adds hardware optimizations for foldable form factors with dual displays.
Emman has been writing technical and feature articles since 2010. Prior to this, he became one of the instructors at Asia Pacific College in 2008, and eventually landed a job as Business Analyst and Technical Writer at Integrated Open Source Solutions for almost 3 years.
