In its annual summit, Qualcomm unveiled its new chipsets – the Snapdragon 865 and Snapdragon 765/765G. The Snapdragon 865 is the successor to the 855, while the 765/765G is a new chipset with integrated 5G support.
The Qualcomm Snapdragon 865 includes the Snapdragon X55 Modem-RF System. The Modem succeeds the X50 Modem with a more power-efficient process. It also has higher theoretical down/up speeds and supports SA/NSA networks. The X55 also supports both mmWave and Sub-6GHz networks with improved bandwidth of Sub-6Ghz.
Not much is known as far as the details of the Snapdragon 765 (G) go aside from integrated 5G support.
The company also announced its new in-display technology – 3D Sonic Max. The new sensor has a larger workable area and even allows two fingers to authenticate. Its accuracy has also been improved. The Sonic Max builds on the current 3D Sonic Sensor which is found on the Samsung Galaxy S10. Whether we see the new 3D Sonic Max on the upcoming Galaxy S11, we’ll just have to wait and see.